13500 search results - page 194 / 2700 » Improved analysis of D |
172
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CODES
2007
IEEE
16 years 18 days ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
127
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SIGDOC
2005
ACM
15 years 11 months ago
2005
ACM
Software engineering has been striving for years to improve the practice of software development and maintenance. Documentation has long been prominent on the list of recommended ...
164
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DAC
2005
ACM
15 years 8 months ago
2005
ACM
Grid-warping is a recent placement strategy based on a novel physical analogy: rather than move the gates to optimize their location, it elastically deforms a model of the 2-D chi...
195
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ESTIMEDIA
2008
Springer
15 years 8 months ago
2008
Springer
The relentless increase in multimedia embedded system application requirements as well as improvements in IC design technology have motivated the deployment of chip multiprocessor ...