This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
Bryan Black, Donald Nelson, Clair Webb, Nick Samra
Background: Current imaging methods such as Magnetic Resonance Imaging (MRI), Confocal microscopy, Electron Microscopy (EM) or Selective Plane Illumination Microscopy (SPIM) yield...
Benjamin Schmid, Johannes E. Schindelin, Albert Ca...