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94
Voted
DATE
2009
IEEE
113views Hardware» more  DATE 2009»
15 years 7 months ago
System-level process variability analysis and mitigation for 3D MPSoCs
Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
Siddharth Garg, Diana Marculescu
ICPR
2002
IEEE
16 years 1 months ago
Structural Brain Asymmetry as Revealed by 3D Texture Analysis of Anatomical MR Images
Vassili A. Kovalev, Frithjof Kruggel, D. Yves von ...
60
Voted
CHI
2002
ACM
16 years 1 months ago
Illuminating clay: a 3-D tangible interface for landscape analysis
Ben Piper, Carlo Ratti, Hiroshi Ishii
110
Voted
CHI
2002
ACM
16 years 1 months ago
Evaluating the effectiveness of spatial memory in 2D and 3D physical and virtual environments
User interfaces can improve task performance by exploiting the powerful human capabilities for spatial cognition. This opportunity has been demonstrated by many prior experiments....
Andy Cockburn, Bruce J. McKenzie
97
Voted
GLVLSI
2006
IEEE
119views VLSI» more  GLVLSI 2006»
15 years 6 months ago
Thermal analysis of a 3D die-stacked high-performance microprocessor
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
Kiran Puttaswamy, Gabriel H. Loh