As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
As energy-related costs have become a major economical factor for IT infrastructures and data-centers, companies and the research community are being challenged to find better an...
HCI, CSCW, and ubicomp researchers have developed new technologies and interaction techniques to support collaboration, ranging from electronic whiteboards to software supporting ...
Dynamic loading of software components (e.g., libraries or modules) is a widely used mechanism for improved system modularity and flexibility. Correct component resolution is cri...
When developers change a program, regression tests can fail not only due to faults in the program but also due to outof-date test code that does not reflect the desired behavior ...