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131
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HPCA
2012
IEEE
13 years 8 months ago
Booster: Reactive core acceleration for mitigating the effects of process variation and application imbalance in low-voltage chi
Lowering supply voltage is one of the most effective techniques for reducing microprocessor power consumption. Unfortunately, at low voltages, chips are very sensitive to process ...
Timothy N. Miller, Xiang Pan, Renji Thomas, Naser ...
195
Voted
ICDE
2008
IEEE
120views Database» more  ICDE 2008»
16 years 1 months ago
Sideways Information Passing for Push-Style Query Processing
In many modern data management settings, data is queried from a central node or nodes, but is stored at remote sources. In such a setting it is common to perform "pushstyle&qu...
Zachary G. Ives, Nicholas E. Taylor
99
Voted
ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
15 years 4 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
SIGIR
2011
ACM
14 years 3 months ago
Learning search tasks in queries and web pages via graph regularization
As the Internet grows explosively, search engines play a more and more important role for users in effectively accessing online information. Recently, it has been recognized that ...
Ming Ji, Jun Yan, Siyu Gu, Jiawei Han, Xiaofei He,...
120
Voted
CODES
2007
IEEE
15 years 6 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick