19936 search results - page 3449 / 3988 » Inductive process modeling |
151
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
159
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
As the number of cores continues to grow in both digital signal and general purpose processors, tools which perform automatic scheduling from model-based designs are of increasing...
179
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GLOBECOM
2009
IEEE
16 years 1 months ago
2009
IEEE
—This paper analyzes the carrier-to-interference ratio of the so-called shotgun cellular system (SCS). In the SCS, basestations are placed randomly according to a two-dimensional...
168
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GLOBECOM
2009
IEEE
16 years 1 months ago
2009
IEEE
— A radio frequency identification (RFID) system consists of a set of readers and several objects, equipped with small computer chips, called tags. In a dense RFID system, where...
167
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GLOBECOM
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—The capacity of today’s cellular mobile communications systems is mainly limited by inter-cell interference. Multi-cell joint transmission or joint detection schemes a...