Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
Mobile and pervasive applications frequently rely on devices such as RFID antennas or sensors (light, temperature, motion) to provide them information about the physical world. Th...
Nodira Khoussainova, Magdalena Balazinska, Dan Suc...
Our physical bodies play a central role in shaping human experience in the world, understanding of the world, and interactions in the world. This paper draws on theories of embodi...
-In this paper, we present an integration of SCI (Scalable Coherent Interface[5]) into the TCP/IP protocol stack of Linux for high bandwidth low latency communication within two or...
Ralf Grosse Borger, Roger Butenuth, Hans-Ulrich He...
Process technology has reduced in size such that it is possible to implement complete applicationspecific architectures as Systems-on-Chip (SoCs) using both Application-Specific I...