Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
We present a novel approach for adaptively grouping and subdividing hair using discrete level-of-detail (LOD) representations. The set of discrete LODs include hair strands, clust...
The emergence of recent XML-based technologies paved the way for new types of architectures and message exchanges on the Internet through Web services. MashUps consist in combinin...
Yosri Harzallah, Vincent Michel, Qi Liu, Gabriel A...
— In this paper we present a framework for grasp planning with a humanoid robot arm and a five-fingered hand. The aim is to provide the humanoid robot with the ability of grasp...
Antonio Morales, Tamim Asfour, Pedram Azad, Steffe...
This paper presents analysis methods for energy estimation in RC trees driven by time-varying voltage sources, e.g., buffers, timevarying power supplies, and resonant clock genera...