6 search results - page 1 / 2 » Interconnect thermal modeling for determining design limits ... |
75
Voted
ISPD
1999
ACM
15 years 4 months ago
1999
ACM
90
Voted
ISLPED
2009
ACM
15 years 7 months ago
2009
ACM
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
ICCAD
2001
IEEE
15 years 9 months ago
2001
IEEE
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
97
Voted
VLSID
2009
IEEE
16 years 1 months ago
2009
IEEE
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
VLSID
2000
IEEE
15 years 4 months ago
2000
IEEE
The test signal method can be used to measure and model inductance parameters (self and mutual) of a very small interconnect especially in highdensity IC’s by using a test signa...