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CODES
2007
IEEE
16 years 14 days ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
CODES
2007
IEEE
16 years 14 days ago
Performance modeling for early analysis of multi-core systems
Performance analysis of microprocessors is a critical step in defining the microarchitecture, prior to register-transfer-level (RTL) design. In complex chip multiprocessor systems...
Reinaldo A. Bergamaschi, Indira Nair, Gero Dittman...
CODES
2007
IEEE
16 years 14 days ago
A code-generator generator for multi-output instructions
We address the problem of instruction selection for Multi-Output Instructions (MOIs), producing more than one result. Such inherently parallel hardware instructions are very commo...
Hanno Scharwächter, Jonghee M. Youn, Rainer L...
CCS
2007
ACM
16 years 9 days ago
Multi-module vulnerability analysis of web-based applications
In recent years, web applications have become tremendously popular, and nowadays they are routinely used in security-critical environments, such as medical, financial, and milita...
Davide Balzarotti, Marco Cova, Viktoria Felmetsger...
169
Voted
EMSOFT
2007
Springer
16 years 9 days ago
Exploiting non-volatile RAM to enhance flash file system performance
Non-volatile RAM (NVRAM) such as PRAM (Phase-change RAM), FeRAM (Ferroelectric RAM), and MRAM (Magnetoresistive RAM) has characteristics of both non-volatile storage and random ac...
In Hwan Doh, Jongmoo Choi, Donghee Lee, Sam H. Noh
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