1965 search results - page 249 / 393 » Layered Design Visualisation |
129
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DATE
2009
IEEE
15 years 8 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
106
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SIGCOMM
2009
ACM
15 years 8 months ago
2009
ACM
Enterprise network security is typically reactive, and it relies heavily on host security and middleboxes. This approach creates complicated interactions between protocols and sys...
114
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ICCAD
2008
IEEE
15 years 8 months ago
2008
IEEE
— The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O’s in VLSI designs; it can achieve smaller package size, shorter wirelength, an...
120
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VTC
2007
IEEE
15 years 8 months ago
2007
IEEE
— Hydra is a flexible wireless network testbed being developed at UT Austin. Our focus is networks that support multiple wireless hops and where the network, especially the MAC,...
143
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ECBS
2005
IEEE
15 years 7 months ago
2005
IEEE
This paper describes a comprehensive prototype of large-scale fault adaptive embedded software developed for the proposed Fermilab BTeV high energy physics experiment. Lightweight...