248 search results - page 5 / 50 » Layered Switching for Networks on Chip |
127
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DATE
2009
IEEE
15 years 8 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
122
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ASPDAC
2009
ACM
15 years 8 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
125
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TCAD
2010
14 years 8 months ago
2010
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
118
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ICC
2008
IEEE
15 years 8 months ago
2008
IEEE
— In this paper we discuss the effect of physical impairments on manycasting service over the optical burstswitched (OBS) networks. Signal quality degradation in manycast network...
ISCAS
2006
IEEE
15 years 7 months ago
2006
IEEE
Abstract— Providing Quality-of-Service (QoS) in networks-onchip (NoCs) will be an important consideration for the complex multiprocessor chips of the future. In this paper, we di...