1295 search results - page 222 / 259 » Layered manufacturing technologies |
DATE
2010
IEEE
15 years 2 months ago
2010
IEEE
—In a conventional SoC designs, on-chip memories occupy more than the 50% of the total die area. 3D technology enables the distribution of logic and memories on separate stacked ...
COOPIS
2002
IEEE
15 years 2 months ago
2002
IEEE
CORBA is an important standard middleware used in the development of distributed applications. It has also been used with distributed real-time applications, through its extension ...
ISQED
2002
IEEE
15 years 2 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
CAISE
2001
Springer
15 years 2 months ago
2001
Springer
A major requirement in Software Engineering is to reduce the time to market. This requirement along with a demand for product sophistication and better quality has led to larger te...
WER
2001
Springer
15 years 2 months ago
2001
Springer
Workflow technology has reached a reasonable degree of maturity, with a number of both research prototypes and commercial systems available. However, methodological issues have rec...