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NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
15 years 4 months ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...
IFIP
1997
Springer
15 years 4 months ago
A simulation model for designing the automation of future's factory
The factory of the future is going to have a high, but not full, degree of automation. There are three reasons for that. First, no great level of automation is compatible with req...
Javier Borda Elejabarrieta
FOMI
2008
15 years 1 months ago
IPAS ontology development
There is a trend in some manufacturing industries to move from selling products to providing services. As a result, designers must consider the life-cycle costs. In the aero indust...
David W. Fowler, Quentin Reul, Derek H. Sleeman
108
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IFIP
1998
Springer
15 years 4 months ago
Mobile agent technology in support of sales order processing in the virtual enterprise
The flexible integration of a range of disparate IT applications is a key requirement for today's global enterprises. The virtual enterprise, formed by a collection of collab...
Todd Papaioannou, John Edwards
ISLPED
1996
ACM
93views Hardware» more  ISLPED 1996»
15 years 4 months ago
250-600 Mhz 12b digital filters in 0.8-0.25um Bulk and SOI CMOS technologies
This paper describes a family of high-speed Finite Impulse Response (FIR) digital filters that have been scaled across three generations of CMOS processes. The processes include c...
Lars E. Thon, Ghavam G. Shahidi, Werner Rausch, Ge...