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109
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MICRO
2006
IEEE
15 years 8 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
111
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MICRO
2006
IEEE
15 years 8 months ago
2006
IEEE
As the industry moves toward larger-scale chip multiprocessors, the need to parallelize applications grows. High inter-thread communication delays, exacerbated by over-stressed hi...
107
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MICRO
2006
IEEE
15 years 8 months ago
2006
IEEE
To protect processor logic from soft errors, multicore redundant architectures execute two copies of a program on separate cores of a chip multiprocessor (CMP). Maintaining identi...
105
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NOMS
2006
IEEE
15 years 8 months ago
2006
IEEE
— Flow-level traffic measurement is required for a wide range of applications including accounting, network planning and security management. A key design challenge is how to gr...
128
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P2P
2006
IEEE
15 years 8 months ago
2006
IEEE
P2P systems that rely on the voluntary contribution of bandwidth by the individual peers may suffer from freeriding. To address this problem, mechanisms enforcing fairness in band...