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» Lectures on VLSI and Integrated Circuit Design
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DAC
2007
ACM
15 years 10 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
ICCD
2005
IEEE
124views Hardware» more  ICCD 2005»
15 years 6 months ago
A Thermally-Aware Methodology for Design-Specific Optimization of Supply and Threshold Voltages in Nanometer Scale ICs
As CMOS technology scales deeper into the nanometer regime, factors such as leakage power and chip temperature emerge as critically important concerns for VLSI design. This paper,...
Sheng-Chih Lin, Navin Srivastava, Kaustav Banerjee
GLVLSI
2006
IEEE
120views VLSI» more  GLVLSI 2006»
15 years 3 months ago
Sensitivity evaluation of global resonant H-tree clock distribution networks
A sensitivity analysis of resonant H-tree clock distribution networks is presented in this paper for a TSMC 0.18 μm CMOS technology. The analysis focuses on the effect of the dri...
Jonathan Rosenfeld, Eby G. Friedman
GLVLSI
2009
IEEE
112views VLSI» more  GLVLSI 2009»
15 years 4 months ago
Simultaneous shield and repeater insertion
Resource based optimization for high performance integrated circuits is presented. The methodology is applied to simultaneous shield and repeater insertion, resulting in minimum c...
Renatas Jakushokas, Eby G. Friedman
VLSID
2009
IEEE
150views VLSI» more  VLSID 2009»
15 years 10 months ago
TIGUAN: Thread-Parallel Integrated Test Pattern Generator Utilizing Satisfiability ANalysis
We present the automatic test pattern generator TIGUAN based on a thread-parallel SAT solver. Due to a tight integration of the SAT engine into the ATPG algorithm and a carefully ...
Alejandro Czutro, Ilia Polian, Matthew D. T. Lewis...