239 search results - page 18 / 48 » Lectures on VLSI and Integrated Circuit Design |
81
Voted
GLVLSI
2005
IEEE
15 years 3 months ago
2005
IEEE
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...
83
Voted
GLVLSI
2003
IEEE
15 years 2 months ago
2003
IEEE
Power-awareness indicates the scalability of the system energy with changing conditions and quality requirements. Multipliers are essential elements used in DSP applications and c...
94
Voted
SPAA
2000
ACM
15 years 1 months ago
2000
ACM
Modern VLSI processing supports a two-dimensional surface for active devices along with multiple stacked layers of interconnect. With the advent of planarization, the number of la...
VLSID
2010
IEEE
14 years 7 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
IH
1998
Springer
15 years 1 months ago
1998
Springer
Advanced CAD tools and high-density VLSI technologies have combined to create a new market for reusable digital designs. The economic viability of the new core-based design paradig...