We present a novel application for carbon nanotube devices, implementing a high density 3-D capacitor, which can be useful for decoupling applications to reduce supply voltage var...
Mark M. Budnik, Arijit Raychowdhury, Aditya Bansal...
Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends...
Jason Cong, David Zhigang Pan, Lei He, Cheng-Kok K...
— With advanced VLSI manufacturing technology in deep submicron (DSM) regime, we can integrate entire electronic systems on a single chip (SoC). Due to the complexity in SoC desi...
Process variations have become a key concern of circuit designers because of their significant, yet hard to predict impact on performance and signal integrity of VLSI circuits. St...
With power becoming a major constraint for multi-processor embedded systems, it is becoming important for designers to characterize and model processor power dissipation. It is cr...
Young-Hwan Park, Sudeep Pasricha, Fadi J. Kurdahi,...