Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stres...
The interconnection delay of pre-fabricated design style dominates circuit delay due to the heavily downstream capacitance. Buffer insertion is a widely used technique to split o...
Increasing resistivity of copper with scaling and rising demands on current density requirements are driving the need to identify new wiring solutions for deep nanometer scale VLS...
For many years, CMOS process scaling has allowed a steady increase in the operating frequency and integration density of integrated circuits. Only recently, however, have we reach...
Parallel counters are key elements in many arithmetic circuits, especially fast multipliers. In this paper, novel architectures and designs for high speed, low power (3, 2), (7, 3...