Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
The ever growing need for improved security, surveillance and identity protection, calls for the creation of evermore reliable and robust face recognition technology that is scala...
Jose Rafael Tena, Raymond S. Smith, Miroslav Hamou...
This paper describes a robust mechanism for transmitting 3D meshes over the Internet. TCP/IP is an excellent means for reliable transport over the Internet. However, multi-user, r...
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
Balaji Vaidyanathan, Wei-Lun Hung, Feng Wang 0004,...
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...