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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
14 years 7 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
ICCAD
2009
IEEE
144views Hardware» more  ICCAD 2009»
14 years 7 months ago
Virtual probe: A statistically optimal framework for minimum-cost silicon characterization of nanoscale integrated circuits
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die va...
Xin Li, Rob A. Rutenbar, R. D. (Shawn) Blanton
ICIP
2009
IEEE
14 years 7 months ago
Optimized energy allocation in battery powered image sensor networks
We investigate energy allocation strategies in image sensor networks for the purpose of maximizing the network operational lifetime. For the application scenarios that we consider...
Chao Yu, Gaurav Sharma
CCE
2010
14 years 7 months ago
Combined mass and energy integration in process design at the example of membrane-based gas separation systems
This paper presents an approach for combined mass and energy integration in process synthesis and illustrates it at the thermochemical production of crude synthetic natural gas (S...
Martin Gassner, François Maréchal
CVPR
2011
IEEE
14 years 5 months ago
Contour-Based Joint Clustering of Multiple Segmentations
We present an unsupervised, shape-based method for joint clustering of multiple image segmentations. Given two or more closely-related images, such as nearby frames in a video sequ...
Daniel Glasner, Shiv N. Vitaladevuni and Ronen Bas...