Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die va...
We investigate energy allocation strategies in image sensor networks for the purpose of maximizing the network operational lifetime. For the application scenarios that we consider...
This paper presents an approach for combined mass and energy integration in process synthesis and illustrates it at the thermochemical production of crude synthetic natural gas (S...
We present an unsupervised, shape-based method for joint clustering of multiple image segmentations. Given two or more closely-related images, such as nearby frames in a video sequ...
Daniel Glasner, Shiv N. Vitaladevuni and Ronen Bas...