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ICCAD
2006
IEEE
127views Hardware» more  ICCAD 2006»
15 years 6 months ago
Joint design-time and post-silicon minimization of parametric yield loss using adjustable robust optimization
Parametric yield loss due to variability can be effectively reduced by both design-time optimization strategies and by adjusting circuit parameters to the realizations of variable...
Murari Mani, Ashish Kumar Singh, Michael Orshansky
ICCAD
2006
IEEE
117views Hardware» more  ICCAD 2006»
15 years 6 months ago
Post-routing redundant via insertion and line end extension with via density consideration
- Redundant via insertion and line end extension employed in the post-routing stage are two well known and highly recommended techniques to reduce yield loss due to via failure. Ho...
Kuang-Yao Lee, Ting-Chi Wang, Kai-Yuan Chao
ICCAD
2006
IEEE
122views Hardware» more  ICCAD 2006»
15 years 6 months ago
Fill for shallow trench isolation CMP
Shallow trench isolation (STI) is the mainstream CMOS isolation technology. It uses chemical mechanical planarization (CMP) to remove excess of deposited oxide and attain a planar...
Andrew B. Kahng, Puneet Sharma, Alexander Zelikovs...
ICCAD
2002
IEEE
227views Hardware» more  ICCAD 2002»
15 years 6 months ago
Generic ILP versus specialized 0-1 ILP: an update
Optimized solvers for the Boolean Satisfiability (SAT) problem have many applications in areas such as hardware and software verification, FPGA routing, planning, etc. Further use...
Fadi A. Aloul, Arathi Ramani, Igor L. Markov, Kare...
ISPD
2010
ACM
217views Hardware» more  ISPD 2010»
15 years 4 months ago
ITOP: integrating timing optimization within placement
Timing-driven placement is a critical step in nanometerscale physical synthesis. To improve design timing on a global scale, net-weight based global timing-driven placement is a c...
Natarajan Viswanathan, Gi-Joon Nam, Jarrod A. Roy,...