3 search results - page 1 / 1 » Low-Overhead Core Swapping for Thermal Management |
69
Voted
PACS
2004
Springer
15 years 3 months ago
2004
Springer
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managemen...
66
Voted
ICCD
2005
IEEE
15 years 6 months ago
2005
IEEE
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managem...
79
Voted
ASPLOS
2008
ACM
14 years 11 months ago
2008
ACM
Future multicore processors will be more susceptible to a variety of hardware failures. In particular, intermittent faults, caused in part by manufacturing, thermal, and voltage v...