139 search results - page 28 / 28 » MB : An Integrated Architecture for Pervasive Computing and... |
HPCA
2011
IEEE
12 years 10 months ago
2011
IEEE
Extreme technology integration in the sub-micron regime comes with a rapid rise in heat dissipation and power density for modern processors. Dynamic voltage scaling is a widely us...
DAC
2002
ACM
14 years 7 months ago
2002
ACM
Increasing non-recurring engineering (NRE) and mask costs are making it harder to turn to hardwired Application Specific Integrated Circuit (ASIC) solutions for high performance a...
DAC
2003
ACM
14 years 7 months ago
2003
ACM
Power dissipation is becoming the most challenging design constraint in nanometer technologies. Among various design implementation schemes, standard cell ASICs offer the best pow...
ICCAD
2009
IEEE
13 years 4 months ago
2009
IEEE
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...