26 search results - page 3 / 6 » MCM placement using a realistic thermal model |
ISCAS
1999
IEEE
15 years 1 months ago
1999
IEEE
- Micromachined power sensors with operation up to 50 GHz were recently achieved in CMOS technology [1]. To improve their sensitivity and signal-to-noise ratio, while maintaining m...
104
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NANONET
2009
Springer
15 years 2 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
WSCG
2003
14 years 10 months ago
2003
This paper describes a technique for producing realistic animations of melting objects. The work presented here introduces a method that accurately models both thermal flow and t...
DAC
2008
ACM
15 years 10 months ago
2008
ACM
In the design of complex power distribution networks (PDN) with multiple power islands, it is required that the PDN represents a low impedance as seen by the digital modules. This...
GLVLSI
2006
IEEE
15 years 3 months ago
2006
IEEE
Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to high...