20 search results - page 3 / 4 » MEMS Fabrication |
63
Voted
CORR
2008
Springer
14 years 9 months ago
2008
Springer
The very significant growth of the wireless communication industry has spawned tremendous interest in the development of high performances radio frequencies (RF) components. Micro...
CORR
2008
Springer
14 years 9 months ago
2008
Springer
A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is co...
67
Voted
ISCAS
2006
IEEE
2006
IEEE
Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures
15 years 3 months ago
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
CORR
2008
Springer
14 years 9 months ago
2008
Springer
The extensive research and development of micromechanical resonators is trying to allow the use of these devices for highly sensitive applications. Microcantilevers are some of th...
CORR
2008
Springer
14 years 9 months ago
2008
Springer
Thermal micro-actuators are a promising solution to the need for large-displacement, gentle handling force, low-power MEMS actuators. Potential applications of these devices are mi...