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83
Voted
CCGRID
2009
IEEE
15 years 1 months ago
2009
IEEE
The understanding of H diffusion in materials is pivotal to designing suitable processes. Though a nudged elastic band (NEB)+molecular dynamics (MD)/quantum mechanics (QM) algori...
DAC
2010
ACM
15 years 1 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
SC
2004
ACM
15 years 3 months ago
2004
ACM
We describe an innovative highly parallel application program, ParaDiS, which computes the plastic strength of materials by tracing the evolution of dislocation lines over time. W...
ICARIS
2003
Springer
15 years 2 months ago
2003
Springer
Within immunology, new theories are constantly being proposed that challenge current ways of thinking. These include new theories regarding how the immune system responds to pathog...
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EUROMICRO
2000
IEEE
15 years 2 months ago
2000
IEEE
In this paper, we present a web-based Distributed Virtual Learning Environment (DVLE) that could be used as a sophisticated tool for distance education and collaboration between t...