—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
The integration of microprocessors and field-programmable gate array (FPGA) fabric on a single chip increases both the utility and necessity of tools that automatically move softw...
Scott Sirowy, Yonghui Wu, Stefano Lonardi, Frank V...
While the new generation of hand-held devices, e.g., smart phones, support a rich set of applications, growing complexity of the hardware and runtime environment makes the devices...
Marcello Cinque, Domenico Cotroneo, Zbigniew Kalba...
Recent progress in genomics and proteomics makes it possible to understand the biological networks at the systems level. We aim to develop computational models of learning and memo...
— A trend is emerging in the fields of ambient intelligence (AmI) and autonomous robotics, which points in the direction of a merger between these two fields. The inclusion of ...