— Performance comparison of multiuser OFDM-TDMA and OFDMA systems by considering physical and link cross-layer behavior is conducted in this work. We provide a new framework for ...
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
Jason Cong, Ashok Jagannathan, Yuchun Ma, Glenn Re...
− In this paper, we present a new timing-driven placement algorithm, which attempts to minimize zigzags and crisscrosses on the timing-critical paths of a circuit. We observed th...
We are reaching a crisis with design of user interfaces for consumer electronics. Flashing 12:00 time indicators, push-andhold buttons, and interminable modes and menus are all sy...
In wireless network planning, much effort is spent on the improvement of the network and transport layer – especially for Mobile Ad Hoc Networks. Although in principle realworl...