232 search results - page 33 / 47 » MicroNetwork-Based Integration for SOCs |
DAC
2010
ACM
15 years 3 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
DDECS
2007
IEEE
15 years 6 months ago
2007
IEEE
—An efficient on-chip infrastructure for memory test and repair is crucial to enhance yield and availability of SoCs. A commonly used repair strategy is to equip memories with sp...
114
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CODES
2009
IEEE
15 years 6 months ago
2009
IEEE
A growing number of applications, with diverse requirements, are integrated on the same System on Chip (SoC) in the form of hardware and software Intellectual Property (IP). The d...
CODES
2007
IEEE
15 years 6 months ago
2007
IEEE
Networks on Chip (NoC) have emerged as the design paradigm for scalable System on Chip communication infrastructure. A growing number of applications, often with firm (FRT) or so...
107
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DAC
1999
ACM
15 years 4 months ago
1999
ACM
ion model or flexible PCB solutions cannot offer a valid solution for the next millinium SoCs . James G. Dougherty, Integrated Systems Silicon LTD, Belfast, Northern Ireland ISS an...