232 search results - page 35 / 47 » MicroNetwork-Based Integration for SOCs |
ISQED
2003
IEEE
15 years 5 months ago
2003
IEEE
This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
119
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ESTIMEDIA
2003
Springer
15 years 5 months ago
2003
Springer
— The constant increase in levels of integration and the reduction of the time-to-market have led to the definition of new methodologies stressing reuse. This involves not only ...
101
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ICCAD
2002
IEEE
15 years 4 months ago
2002
IEEE
Shrinking process geometries and the increasing use of IP components in SoC designs give rise to new problems in routing and buffer insertion. A particular concern is that cross-c...
ASPDAC
2000
ACM
15 years 4 months ago
2000
ACM
-- System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory. The key elements of SIP technology include I/O redistribution, so...
111
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FCCM
2004
IEEE
15 years 3 months ago
2004
IEEE
Dynamically Reconfigurable Processor (DRP)[1] developed by NEC Electronics is a coarse grain reconfigurable processor that selects a data path from the on-chip repository of sixte...