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TJS
2002
135views more  TJS 2002»
14 years 9 months ago
HPCVIEW: A Tool for Top-down Analysis of Node Performance
Although it is increasingly difficult for large scientific programs to attain a significant fraction of peak performance on systems based on microprocessors with substantial instr...
John M. Mellor-Crummey, Robert J. Fowler, Gabriel ...
CHI
2002
ACM
15 years 10 months ago
SCANMail: a voicemail interface that makes speech browsable, readable and searchable
Increasing amounts of public, corporate, and private speech data are now available on-line. These are limited in their usefulness, however, by the lack of tools to permit their br...
Steve Whittaker, Julia Hirschberg, Brian Amento, L...
GRID
2000
Springer
15 years 1 months ago
An Advanced User Interface Approach for Complex Parameter Study Process Specification on the Information Power Grid
The creation of parameter study suites has recently become a more challenging problem as the parameter studies have become multi-tiered and the computational environment has becom...
Maurice Yarrow, Karen M. McCann, Rupak Biswas, Rob...
CHI
2008
ACM
15 years 10 months ago
K-sketch: a 'kinetic' sketch pad for novice animators
Because most animation tools are complex and timeconsuming to learn and use, most animations today are created by experts. To help novices create a wide range of animations quickl...
Richard C. Davis, Brien Colwell, James A. Landay
81
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MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
15 years 3 months ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...