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TJS
2002
135views more  TJS 2002»
15 years 4 months ago
HPCVIEW: A Tool for Top-down Analysis of Node Performance
Although it is increasingly difficult for large scientific programs to attain a significant fraction of peak performance on systems based on microprocessors with substantial instr...
John M. Mellor-Crummey, Robert J. Fowler, Gabriel ...
CHI
2002
ACM
16 years 4 months ago
SCANMail: a voicemail interface that makes speech browsable, readable and searchable
Increasing amounts of public, corporate, and private speech data are now available on-line. These are limited in their usefulness, however, by the lack of tools to permit their br...
Steve Whittaker, Julia Hirschberg, Brian Amento, L...
GRID
2000
Springer
15 years 8 months ago
An Advanced User Interface Approach for Complex Parameter Study Process Specification on the Information Power Grid
The creation of parameter study suites has recently become a more challenging problem as the parameter studies have become multi-tiered and the computational environment has becom...
Maurice Yarrow, Karen M. McCann, Rupak Biswas, Rob...
CHI
2008
ACM
16 years 4 months ago
K-sketch: a 'kinetic' sketch pad for novice animators
Because most animation tools are complex and timeconsuming to learn and use, most animations today are created by experts. To help novices create a wide range of animations quickl...
Richard C. Davis, Brien Colwell, James A. Landay
MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
15 years 10 months ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...