— In this paper, we study the survivability problem in hierarchical wireless access networks with dual-homed end users, who are connected to two base stations (BSs), a primary BS...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
Massively parallel computing systems are being built with thousands of nodes. Because of the high number of components, it is critical to keep these systems running even in the pre...
Abstract— This paper focuses on the Delay/Fault-Tolerant Mobile Sensor Network (DFT-MSN) for pervasive information gathering. We develop simple and efficient data delivery schem...
Failures of all forms happen: from losing single network packets to site-wide disasters. Since businesses rely heavily on their data, it is imperative that failures require minima...