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3DIC
2009
IEEE
153views Hardware» more  3DIC 2009»
15 years 7 months ago
Junction-level thermal extraction and simulation of 3DICs
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
114
Voted
ISPW
2009
IEEE
15 years 7 months ago
Distributed Orchestration Versus Choreography: The FOCAS Approach
Web service orchestration is popular because the application logic is defined from a central and unique point of view, but it suffers from scalability issues. In choreography, the ...
Gabriel Pedraza, Jacky Estublier
CIKM
2009
Springer
15 years 7 months ago
Group-by skyline query processing in relational engines
The skyline operator was first proposed in 2001 for retrieving interesting tuples from a dataset. Since then, 100+ skyline-related papers have been published; however, we discove...
Ming-Hay Luk, Man Lung Yiu, Eric Lo
EMMCVPR
2007
Springer
15 years 7 months ago
Bottom-Up Recognition and Parsing of the Human Body
Recognizing humans, estimating their pose and segmenting their body parts are key to high-level image understanding. Because humans are highly articulated, the range of deformation...
Praveen Srinivasan, Jianbo Shi
99
Voted
OTM
2007
Springer
15 years 7 months ago
Property-Preserving Evolution of Components Using VPA-Based Aspects
Abstract. Protocols that govern the interactions between software components are a popular means to support the construction of correct component-based systems. Previous studies ha...
Dong Ha Nguyen, Mario Südholt