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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 1 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
COCOON
2008
Springer
15 years 6 months ago
Haplotype Inferring Via Galled-Tree Networks Is NP-Complete
The problem of determining haplotypes from genotypes has gained considerable prominence in the research community since the beginning of the HapMap project. Here the focus is on de...
Arvind Gupta, Ján Manuch, Ladislav Stacho, ...
149
Voted
SIGMETRICS
2008
ACM
140views Hardware» more  SIGMETRICS 2008»
15 years 5 months ago
Scalable VPN routing via relaying
Enterprise customers are increasingly adopting MPLS (Multiprotocol Label Switching) VPN (Virtual Private Network) service that offers direct any-to-any reachability among the cust...
Changhoon Kim, Alexandre Gerber, Carsten Lund, Dan...
143
Voted
INFOCOM
2009
IEEE
15 years 11 months ago
Multi-VPN Optimization for Scalable Routing via Relaying
—Enterprise networks are increasingly adopting Layer 3 Multiprotocol Label Switching (MPLS) Virtual Private Network (VPN) technology to connect geographically disparate locations...
MohammadHossein Bateni, Alexandre Gerber, Mohammad...
JMLR
2011
148views more  JMLR 2011»
15 years 1 min ago
Multitask Sparsity via Maximum Entropy Discrimination
A multitask learning framework is developed for discriminative classification and regression where multiple large-margin linear classifiers are estimated for different predictio...
Tony Jebara