146 search results - page 7 / 30 » Modeling and temperature control of rapid thermal processing |
87
Voted
ICCAD
2010
IEEE
14 years 7 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
100
Voted
HAPTICS
2007
IEEE
15 years 1 months ago
2007
IEEE
In this paper, a numerical model of the thermal process of touching an object is described. The model takes into account the object geometry and temperature, the thermal parameter...
PCI
2005
Springer
15 years 3 months ago
2005
Springer
Abstract. Increased power density, hot-spots, and temperature gradients are severe limiting factors for today’s state-of-the-art microprocessors. However, the flexibility offer...
VLSID
2007
IEEE
15 years 10 months ago
2007
IEEE
In the past, Field Programmable Gate Array (FPGA) circuits only contained a limited amount of logic and operated at a low frequency. Few applications running on FPGAs consumed exc...
ASPDAC
2008
ACM
14 years 11 months ago
2008
ACM
- With the increasing levels of variability in the behavior of manufactured nano-scale devices and dramatic changes in the power density on a chip, timely identification of hot spo...