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ISLPED
2009
ACM
110views Hardware» more  ISLPED 2009»
15 years 11 months ago
SOI, interconnect, package, and mainboard thermal characterization
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
Joseph Nayfach-Battilana, Jose Renau
ASPDAC
2005
ACM
125views Hardware» more  ASPDAC 2005»
15 years 10 months ago
A formalism for functionality preserving system level transformations
— With the rise in complexity of modern systems, designers are spending a significant time on at the system level of abstraction. This paper introduces Model Algebra, a formalis...
Samar Abdi, Daniel Gajski
MODELS
2009
Springer
15 years 9 months ago
From UML to Alloy and Back Again
Abstract. Model Transformations can be used to bridge the gap between design and analysis technical spaces by creating tools that allow a model produced by a designer to be transfo...
Seyyed M. A. Shah, Kyriakos Anastasakis, Behzad Bo...
CISSE
2007
Springer
15 years 8 months ago
Issues in Simulation for Valuing Long-Term Forwards
Abstract- This paper explores valuing long-term equity forwardcontracts or futures where both the underlying volatility and the interest rates are modeled as stochastic random vari...
Phillip G. Bradford, Alina Olteanu
WSC
1997
15 years 6 months ago
Automating the Metamodeling Process
Model abstraction using metamodeling has demonstrated the capability to facilitate software reuse, large scale model integration, verification, and validation. Once restricted to...
Don Caughlin
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