Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...
Sivakumar Velusamy, Wei Huang, John Lach, Mircea R...
Many successful models for scene or object recognition transform low-level descriptors (such as Gabor filter responses, or SIFT descriptors) into richer representations of interme...
Y-Lan Boureau, Francis Bach, Yann LeCun, Jean Ponc...
Middleware for Web service compositions, such as BPEL engines, provides the execution environment for services as well as additional functionalities, such as monitoring and self-t...
Domenico Bianculli, Walter Binder, Mauro Luigi Dra...