19130 search results - page 3286 / 3826 » Modelling multi-path problems |
163
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DATE
2005
IEEE
16 years 4 days ago
2005
IEEE
Inductive cross-talk within IC packaging is becoming a significant bottleneck in high-speed inter-chip communication. The parasitic inductance within IC packaging causes bounce o...
157
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DATE
2005
IEEE
16 years 4 days ago
2005
IEEE
Overheating has been acknowledged as a major issue in testing complex SOCs. Several power constrained system-level DFT solutions (power constrained test scheduling) have recently ...
168
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EDOC
2005
IEEE
16 years 4 days ago
2005
IEEE
The management of IT landscapes consisting of thousands of business applications, different middleware systems, and supporting various business processes is a challenge for modern...
151
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ESCIENCE
2005
IEEE
16 years 4 days ago
2005
IEEE
This paper describes our experience with SegHidro, a project that empowers hydro-meteorological researchers by (i) enabling collaborative work via the coupling of computer models,...
173
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HAPTICS
2005
IEEE
16 years 4 days ago
2005
IEEE
— We present an algorithm that determines the point on a convex parametric surface patch that is closest to a given (possibly moving) point. Any initial point belonging to the su...