19130 search results - page 3686 / 3826 » Modelling multi-path problems |
112
Voted
ICCAD
2007
IEEE
15 years 11 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
127
Voted
ICCAD
2006
IEEE
15 years 11 months ago
2006
IEEE
Soft-core microprocessors mapped onto field-programmable gate arrays (FPGAs) represent an increasingly common embedded software implementation option. Modern FPGA soft-cores are p...
105
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ICCAD
2005
IEEE
15 years 11 months ago
2005
IEEE
Abstract— We present in this paper a new interconnect-driven multilevel floorplanning, called IMF, to handle large-scale building-module designs. Unlike the traditional multilev...
ICCAD
2005
IEEE
15 years 11 months ago
2005
IEEE
— Although the LUT (look-up table) size of FPGAs has been optimized for general applications, complicated designs may contain a large number of cascaded LUTs between flip-flops...
137
Voted
TLDI
2009
ACM
15 years 11 months ago
2009
ACM
Storing state in the client tier (in forms or cookies, for example) improves the efficiency of a web application, but it also renders the secrecy and integrity of stored data vul...