Sciweavers

1580 search results - page 258 / 316
» Modules for Crosscutting Models
Sort
View
119
Voted
ICCD
2008
IEEE
146views Hardware» more  ICCD 2008»
16 years 24 days ago
Chip level thermal profile estimation using on-chip temperature sensors
—This paper addresses the problem of chip level thermal profile estimation using runtime temperature sensor readings. We address the challenges of a) availability of only a few t...
Yufu Zhang, Ankur Srivastava, Mohamed M. Zahran
ICCD
2005
IEEE
120views Hardware» more  ICCD 2005»
16 years 23 days ago
Novel Low-Overhead Operand Isolation Techniques for Low-Power Datapath Synthesis
: Power consumption in datapath modules due to redundant switching is an important design concern for high-performance applications. Operand isolation schemes are adopted to reduce...
Nilanjan Banerjee, Arijit Raychowdhury, Swarup Bhu...
ICCAD
2005
IEEE
105views Hardware» more  ICCAD 2005»
16 years 22 days ago
Response shaper: a novel technique to enhance unknown tolerance for output response compaction
The presence of unknown values in the simulation result is a key barrier to effective output response compaction in practice. This paper proposes a simple circuit module, called a...
Mango Chia-Tso Chao, Seongmoon Wang, Srimat T. Cha...
123
Voted
CVPR
2010
IEEE
16 years 6 days ago
Learning Mid-Level Features For Recognition
Many successful models for scene or object recognition transform low-level descriptors (such as Gabor filter responses, or SIFT descriptors) into richer representations of interme...
Y-Lan Boureau, Francis Bach, Yann LeCun, Jean Ponc...
DCC
2010
IEEE
15 years 10 months ago
Xampling: Analog Data Compression
We introduce Xampling, a design methodology for analog compressed sensing in which we sample analog bandlimited signals at rates far lower than Nyquist, without loss of informatio...
Moshe Mishali, Yonina C. Eldar