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DSD
2009
IEEE
84views Hardware» more  DSD 2009»
16 years 1 months ago
Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
Ayse Kivilcim Coskun, Andrew B. Kahng, Tajana Simu...
AUTOMOTIVEUI
2009
ACM
16 years 1 months ago
Design space for driver-based automotive user interfaces
Over the last 100 years it has become much easier to operate a car. However in recent years the number of functions a user can control while driving has greatly increased. Infotai...
Dagmar Kern, Albrecht Schmidt
ISCAS
2006
IEEE
121views Hardware» more  ISCAS 2006»
16 years 16 days ago
A frequency domain based TEQ design for DSL systems
that the equivalent channel is approximately an impulse. In [7], Martin et al. propose a globally convergent blind adap-In this paper, we propose a frequency domain based de- tive ...
Yuan-Pei Lin, Yu-Pin Lin, See-May Phoong
VLSID
2006
IEEE
192views VLSI» more  VLSID 2006»
16 years 16 days ago
Beyond RTL: Advanced Digital System Design
This tutorial focuses on advanced techniques to cope with the complexity of designing modern digital chips which are complete systems often containing multiple processors, complex...
Shiv Tasker, Rishiyur S. Nikhil
ITC
1997
IEEE
73views Hardware» more  ITC 1997»
15 years 10 months ago
A Low-Overhead Design for Testability and Test Generation Technique for Core-Based Systems
In a fundamental paradigm shift in system design, entire systems are being built on a single chip, using multiple embedded cores. Though the newest system design methodology has s...
Indradeep Ghosh, Niraj K. Jha, Sujit Dey