5085 search results - page 345 / 1017 » Multidimensional Design by Examples |
176
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DATE
2007
IEEE
16 years 1 months ago
2007
IEEE
—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
171
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GLOBECOM
2007
IEEE
16 years 1 months ago
2007
IEEE
Abstract—In Chebyshev finite-impulse response (FIR) equalization, we design an FIR filter that minimizes the Chebyshev equalization error, i.e., the maximum absolute deviation ...
181
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ISQED
2005
IEEE
16 years 24 days ago
2005
IEEE
Today's System-on-a-Chip (SoC) design methodology provides an efficient way to develop highly integrated systems on a single chip by utilizing pre-designed intellectual prope...
187
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ASAP
2003
IEEE
16 years 15 days ago
2003
IEEE
There is a growing demand for application-specific embedded processors in system-on-a-chip designs. Current tools and design methodologies often require designers to manually spec...
203
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MODELS
2009
Springer
15 years 11 months ago
2009
Springer
Abstract. Model Transformations can be used to bridge the gap between design and analysis technical spaces by creating tools that allow a model produced by a designer to be transfo...