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DAC
2010
ACM
15 years 11 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
ISQED
2006
IEEE
124views Hardware» more  ISQED 2006»
16 years 1 months ago
DFM Metrics for Standard Cells
Design for Manufacturability (DFM) is becoming increasingly important as process geometries shrink. Conventional design rule pass/fail is not adequate to quantify DFM compliance. ...
Robert C. Aitken
FPGA
2005
ACM
195views FPGA» more  FPGA 2005»
16 years 23 days ago
Sparse Matrix-Vector multiplication on FPGAs
Floating-point Sparse Matrix-Vector Multiplication (SpMXV) is a key computational kernel in scientific and engineering applications. The poor data locality of sparse matrices sig...
Ling Zhuo, Viktor K. Prasanna
203
Voted
DOLAP
2004
ACM
16 years 20 days ago
Physical modeling of data warehouses using UML
During the few last years, several approaches have been proposed to model different aspects of a Data Warehouse (DW), such as the conceptual model of the DW, the design of the ET...
Sergio Luján-Mora, Juan Trujillo
CORR
1998
Springer
131views Education» more  CORR 1998»
15 years 7 months ago
Influencing Software Usage
Technology designers often strive to design systems that are flexible enough to be used in a wide range of situations. Software engineers, in particular, are trained to seek gener...
Lorrie Faith Cranor, Rebecca N. Wright