Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
We present a general approach to the FPGA technology mapping problem that applies to any logic block composed of lookup tables LUTs and can yield optimal solutions. The connecti...
This paper focuses on parallelization of the classic static timing analysis (STA) algorithm for verifying timing characteristics of digital integrated circuits. Given ever-increasi...
Akintayo Holder, Christopher D. Carothers, Kerim K...
This paper presents an efficient modeling scheme and a partitioning heuristic for parallelizing VLSI post-placement timing optimization. Encoding the paths with timing violations...
In this paper, we show that under the constant delay model the placement problem is equivalent to minimizing a weighted sum of wire lengths. The weights can be efficiently compute...
Kolja Sulimma, Wolfgang Kunz, Ingmar Neumann, Luka...