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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
15 years 6 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
FPGA
1997
ACM
127views FPGA» more  FPGA 1997»
15 years 1 months ago
General Modeling and Technology-Mapping Technique for LUT-Based FPGAs
We present a general approach to the FPGA technology mapping problem that applies to any logic block composed of lookup tables LUTs and can yield optimal solutions. The connecti...
Amit Chowdhary, John P. Hayes
IPPS
2010
IEEE
14 years 7 months ago
Prototype for a large-scale static timing analyzer running on an IBM Blue Gene
This paper focuses on parallelization of the classic static timing analysis (STA) algorithm for verifying timing characteristics of digital integrated circuits. Given ever-increasi...
Akintayo Holder, Christopher D. Carothers, Kerim K...
IPPS
2006
IEEE
15 years 3 months ago
Parallelizing post-placement timing optimization
This paper presents an efficient modeling scheme and a partitioning heuristic for parallelizing VLSI post-placement timing optimization. Encoding the paths with timing violations...
Jiyoun Kim, Marios C. Papaefthymiou, José N...
DATE
2002
IEEE
102views Hardware» more  DATE 2002»
15 years 2 months ago
Improving Placement under the Constant Delay Model
In this paper, we show that under the constant delay model the placement problem is equivalent to minimizing a weighted sum of wire lengths. The weights can be efficiently compute...
Kolja Sulimma, Wolfgang Kunz, Ingmar Neumann, Luka...