395 search results - page 75 / 79 » Multilevel Circuit Partitioning |
CEC
2009
IEEE
15 years 4 months ago
2009
IEEE
— Many researchers have encountered the problem that the evolution of electronic circuits becomes exponentially more difficult when problems with an increasing number of outputs...
101
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ISPD
2005
ACM
15 years 3 months ago
2005
ACM
The sustained progress of VLSI technology has altered the landscape of routing which is a major physical design stage. For timing driven routings, traditional approaches which con...
ASPDAC
2006
ACM
15 years 1 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
TCAD
1998
14 years 9 months ago
1998
None of the available minimizers for 2-level hazard-free logic minimization can synthesize very large circuits. This limitation has forced researchers to resort to manual and auto...
102
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ASPDAC
2010
ACM
14 years 7 months ago
2010
ACM
As Double Patterning Lithography(DPL) becomes the leading candidate for sub-30nm lithography process, we need a fast and lithography friendly decomposition framework. In this pape...