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ICCAD
2003
IEEE
109views Hardware» more  ICCAD 2003»
16 years 1 months ago
Large-Scale Circuit Placement: Gap and Promise
Placement is one of the most important steps in the RTLto-GDSII synthesis process, as it directly defines the interconnects, which have become the bottleneck in circuit and syste...
Jason Cong, Tim Kong, Joseph R. Shinnerl, Min Xie,...
ICCAD
2003
IEEE
170views Hardware» more  ICCAD 2003»
16 years 1 months ago
Evaluation of Placement Techniques for DNA Probe Array Layout
DNA probe arrays have emerged as a core genomic technology that enables cost-effective gene expression monitoring, mutation detection, single nucleotide polymorphism analysis and ...
Andrew B. Kahng, Ion I. Mandoiu, Sherief Reda, Xu ...
ISPD
2010
ACM
195views Hardware» more  ISPD 2010»
15 years 12 months ago
Density gradient minimization with coupling-constrained dummy fill for CMP control
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
Huang-Yu Chen, Szu-Jui Chou, Yao-Wen Chang
AVSS
2009
IEEE
15 years 12 months ago
A 3D Face Model for Pose and Illumination Invariant Face Recognition
Generative 3D face models are a powerful tool in computer vision. They provide pose and illumination invariance by modeling the space of 3D faces and the imaging process. The powe...
Pascal Paysan, Reinhard Knothe, Brian Amberg, Sami...
MODELS
2009
Springer
15 years 11 months ago
Language support for feature-oriented product line engineering
Product line engineering is an emerging paradigm of developing a family of products. While product line analysis and design mainly focus on reasoning about commonality and variabi...
Wonseok Chae, Matthias Blume