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ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
15 years 8 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
HT
1993
ACM
15 years 3 months ago
Concurrency Control in Collaborative Hypertext Systems
Traditional concurrency control techniques for database systems (transaction management based on locking protocols) have been successful in many multiuser settings, but these tech...
Uffe Kock Wiil, John J. Leggett
WWW
2004
ACM
16 years 14 days ago
Learning block importance models for web pages
Some previous works show that a web page can be partitioned to multiple segments or blocks, and usually the importance of those blocks in a page is not equivalent. Also, it is pro...
Ruihua Song, Haifeng Liu, Ji-Rong Wen, Wei-Ying Ma
SIGUCCS
2005
ACM
15 years 5 months ago
A case study: implementing novell identity management at Drew University
Starting in 2003, Drew University began a process to replace its manual account management procedures with an automated provisioning system based upon Novell technologies. Over th...
E. Axel Larsson
MASS
2010
248views Communications» more  MASS 2010»
14 years 9 months ago
Adaptive exploitation of cooperative relay for high performance communications in MIMO ad hoc networks
With the popularity of wireless devices and the increase of computing and storage resources, there are increasing interests in supporting mobile computing techniques. Particularly...
Shan Chu, Xin Wang