11 search results - page 2 / 3 » Noise Analysis of Fault Tolerant Active Pixel Sensors |
DFT
2004
IEEE
13 years 10 months ago
2004
IEEE
A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned col...
DFT
2005
IEEE
13 years 12 months ago
2005
IEEE
Defect and fault tolerance is being studied in a 3D Heterogeneous Sensor using a stacked chip with sensors located on the top plane, and inter-plane vias connecting these to other...
ISQED
2009
IEEE
14 years 1 months ago
2009
IEEE
We propose a novel design flow for mismatch and processvariation aware optimization of nanoscale CMOS Active Pixel Sensor (APS) arrays. As a case study, an 8 × 8 APS array is de...
IOLTS
2003
IEEE
13 years 11 months ago
2003
IEEE
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
SECON
2007
IEEE
14 years 16 days ago
2007
IEEE
—We consider surveillance applications in which sensors are deployed in large numbers to improve coverage fidelity. Previous research has studied how to select active sensor cov...