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113
Voted
TCAD
2011
14 years 5 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
85
Voted
GLOBECOM
2008
IEEE
15 years 5 months ago
2008
IEEE
—1 In this paper, we consider an amplify-and-forward (AF) wireless relay system where multiple source nodes communicate with their corresponding destination nodes with the help o...
ICASSP
2008
IEEE
15 years 5 months ago
2008
IEEE
Transmit-power control is a critical task in cognitive radio (CR) networks. In the present contribution, adherence to hierarchies between primary and secondary users in a peer-to-...
ICC
2007
IEEE
15 years 5 months ago
2007
IEEE
—Since the provision of both unicast and multicast services is expected for the next generation of multi-carrier wireless systems, the allocation of resources for this combinatio...
WCNC
2010
IEEE
15 years 2 months ago
2010
IEEE
—We study the problem of optimizing the symbol error probability (SEP) performance of cluster-based cooperative wireless sensor networks (WSNs). It is shown in the literature tha...